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The Thermalright LGA177XX-BCF-V2 Black is a high-precision aluminum contact frame designed for Intel LGA1700 and LGA1800 sockets, offering improved CPU mounting stability and better thermal contact by preventing bending of the CPU during cooler installation. Made from durable CNC-machined aluminum alloy, it ensures even mounting pressure across the CPU surface, which can help reduce temperatures by improving the contact between the IHS and the cooler base. The frame is easy to install using the included L-shaped screwdriver and does not interfere with nearby motherboard components. Its matte black finish gives a clean and professional appearance, and it is compatible with Intel 12th, 13th, and 14th Gen processors. Ideal for overclockers and performance users, the LGA177XX-BCF-V2 can potentially lower CPU temperatures by several degrees in systems affected by socket pressure-induced warping.
The Thermalright LGA 177XX-BCF-V2 BLACK is a precision-engineered contact frame designed to improve thermal performance and mechanical stability on Intel LGA 1700-series sockets, which include 12th, 13th, and 14th generation CPUs. Made from high-quality black anodized aluminum alloy, this updated V2 version enhances structural rigidity by replacing the default stock ILM (Integrated Loading Mechanism), which can cause CPU bending and uneven cooler contact. The frame provides more uniform pressure distribution across the CPU surface, reducing socket flex and ensuring better contact between the CPU and heatsink, which can lead to noticeable temperature reductions under load. Compact and lightweight, it includes an L-shaped screwdriver for easier installation and is compatible with most LGA 1700 motherboards. The Thermalright LGA 177XX-BCF-V2 BLACK is an excellent upgrade for enthusiasts and PC builders looking to protect their CPU investment and optimize thermal efficiency, especially in overclocked or high-performance systems.