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The Thermalright TF9 1.5G is a high-performance thermal paste designed for efficient heat transfer between CPUs or GPUs and their coolers. It features a thermal conductivity of 14 W/m·K and a thermal impedance of less than 0.01 °C·cm²/W, making it ideal for demanding applications like gaming, overclocking, or professional workloads. The compound is electrically non-conductive, ensuring safe application around sensitive components. It has a wide operating temperature range from -220 °C to +380 °C, ensuring consistent performance under extreme conditions. The TF9 comes in a 1.5-gram syringe with an included spatula for easy and even application, making it suitable for both beginners and experienced builders seeking reliable thermal performance.
The Thermalright TF9 1.5 g thermal paste is a high-performance, non-electrically conductive compound engineered to deliver professional-grade cooling in a compact syringe form. It offers a strong thermal conductivity of 14 W/m·K and very low thermal impedance (< 0.01 ℃·cm²/W), ensuring efficient heat transfer between CPU/GPU and cooler. With a wide operational range from –220 °C to 380 °C, this gray-colored paste remains stable under extreme temperature conditions, while its specific gravity of 2.9 promotes smooth application. The 1.5-gram tube comes with a precision applicator and spatula, making it easy for beginners and enthusiasts to apply evenly. Safe for all electronic components and non-corrosive, it’s ideal for a variety of cooling setups, from standard cooling loops to overclocked systems